<?xml version="1.0" encoding="UTF-8"?>
<!DOCTYPE article PUBLIC "-//NLM//DTD JATS (Z39.96) Journal Publishing DTD v1.3 20210610//EN" "JATS-journalpublishing1-3.dtd">
<article article-type="research-article" dtd-version="1.3" xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xml:lang="ru"><front><journal-meta><journal-id journal-id-type="publisher-id">trudyniisi</journal-id><journal-title-group><journal-title xml:lang="ru">Труды НИИСИ</journal-title><trans-title-group xml:lang="en"><trans-title>SRISA Proceedings</trans-title></trans-title-group></journal-title-group><issn pub-type="ppub">2225-7349</issn><issn pub-type="epub">3033-6422</issn><publisher><publisher-name>НИЦ «КУРЧАТОВСКИЙ ИНСТИТУТ» - НИИСИ</publisher-name></publisher></journal-meta><article-meta><article-id pub-id-type="doi">10.25682/NIISI.2025.1.0004</article-id><article-id custom-type="elpub" pub-id-type="custom">trudyniisi-5</article-id><article-categories><subj-group subj-group-type="heading"><subject>Research Article</subject></subj-group><subj-group subj-group-type="section-heading" xml:lang="ru"><subject>ВЫЧИСЛИТЕЛЬНЫЕ СИСТЕМЫ И ИХ ЭЛЕМЕНТЫ</subject></subj-group><subj-group subj-group-type="section-heading" xml:lang="en"><subject>COMPUTING SYSTEMS AND THEIR COMPONENTS</subject></subj-group></article-categories><title-group><article-title>Теплопроводность кремниевого полевого GАА нанотранзистора с учетом шероховатости границы</article-title><trans-title-group xml:lang="en"><trans-title>Thermal Conductivity of a Silicon GAA Field-Effect Nanotransistor, Taking into Account the Roughness of the Boundary</trans-title></trans-title-group></title-group><contrib-group><contrib contrib-type="author" corresp="yes"><name-alternatives><name name-style="eastern" xml:lang="ru"><surname>Масальский</surname><given-names>H. B.</given-names></name><name name-style="western" xml:lang="en"><surname>Masalsky</surname><given-names>N. V.</given-names></name></name-alternatives><bio xml:lang="ru"><p>Москва</p></bio><email xlink:type="simple">volkov@niisi.ras</email><xref ref-type="aff" rid="aff-1"/></contrib></contrib-group><aff-alternatives id="aff-1"><aff xml:lang="ru">НИЦ «Курчатовский институт» — НИИСИ<country>Россия</country></aff></aff-alternatives><pub-date pub-type="collection"><year>2025</year></pub-date><pub-date pub-type="epub"><day>29</day><month>09</month><year>2025</year></pub-date><volume>15</volume><issue>1</issue><issue-title>МАТЕМАТИЧЕСКОЕ И КОМПЬЮТЕРНОЕ МОДЕЛИРОВАНИЕ СЛОЖНЫХ СИСТЕМ:  ТЕОРЕТИЧЕСКИЕ И ПРИКЛАДНЫЕ АСПЕКТЫ</issue-title><fpage>26</fpage><lpage>32</lpage><permissions><copyright-statement>Copyright &amp;#x00A9; Масальский H.B., 2025</copyright-statement><copyright-year>2025</copyright-year><copyright-holder xml:lang="ru">Масальский H.B.</copyright-holder><copyright-holder xml:lang="en">Masalsky N.V.</copyright-holder><license license-type="creative-commons-attribution" xlink:href="https://creativecommons.org/licenses/by/4.0/" xlink:type="simple"><license-p>This work is licensed under a Creative Commons Attribution 4.0 License.</license-p></license></permissions><self-uri xlink:href="https://www.t-niisi.ru/jour/article/view/5">https://www.t-niisi.ru/jour/article/view/5</self-uri><abstract><p>Обсуждается тепловая модель для кремниевых полевых GAА нанотранзисторов с учетом тепловых воздействий, вызванных шероховатостью границы. Модель построена на основе метода теории возмущений, в котором учитывается влияние зависимости диаметра нанопроволоки и шероховатости поверхности на теплопроводность канала транзистора, а также влияние особенностей GAА нанотранзисторной структуры на рассеивание тепла. В данном случае для тепловой коррекции модели транзистора (идеализированной), для которой разработана апробированная математическая модель, следует добавить слабое возмущение через дополнительный "возмущающий" гамильтониан. Тогда различные физические величины, связанные с возмущенной системой, могут быть выражены как "поправки" к характеристикам исходной модели. Эти поправки в априори малы по сравнению с размером самих величин. Однако они 1) существенно изменяют характеристики исходной системы, 2) упрощают алгоритмы их вычисления. На основе модели обсуждается влияние параметров конструкции GAА нанотранзисторов на его тепловыделение. Разработанная модель может быть применена для проектирования схем на основе GAА нанотранзисторов с учетом тепловых факторов.</p></abstract><trans-abstract xml:lang="en"><p>A thermal model for silicon field-effect GAA nanotransistors is discussed, taking into account the thermal effects caused by boundary roughness. The model is based on the perturbation theory method, which takes into account the effect of the dependence of the nanowire diameter and surface roughness on the thermal conductivity of the transistor channel, as well as the effect of the characteristics of the GAA nanotransistor structure on heat dissipation. In this case, for thermal correction of the (idealized) transistor model, for which a proven mathematical model has been developed, a weak perturbation should be added through an additional "perturbing" Hamiltonian. Then the various physical quantities associated with the perturbed system can be expressed as "corrections" to the characteristics of the original model. These corrections are a priori small compared to the size of the quantities themselves. However, they 1) significantly change the characteristics of the initial system, and 2) simplify the algorithms for their calculation. Based on the model, the influence of the nanotransistor chip design parameters on its heat dissipation is discussed. The developed model can be used to design circuits based on nanotransistor chips, taking into account thermal factors. </p></trans-abstract><kwd-group xml:lang="ru"><kwd>кремниевый gate-all-around (GAA) нанотранзистор</kwd><kwd>теплопроводность</kwd><kwd>шероховатость границы</kwd><kwd>корреляционная длина</kwd><kwd>средне квадратичное отклонение</kwd></kwd-group><kwd-group xml:lang="en"><kwd>silicon gate-all-around (GAA) nanotransistor</kwd><kwd>thermal conductivity</kwd><kwd>boundary roughness</kwd><kwd>correlation length</kwd><kwd>mean square deviation</kwd></kwd-group></article-meta></front><back><ref-list><title>References</title><ref id="cit1"><label>1</label><citation-alternatives><mixed-citation xml:lang="ru">Nanoelectronics: Devices, Circuits and Systems. Editor by Brajesh Kumar Kaushik. Elsevier, 2018.</mixed-citation><mixed-citation xml:lang="en">Nanoelectronics: Devices, Circuits and Systems. Editor by Brajesh Kumar Kaushik. Elsevier, 2018.</mixed-citation></citation-alternatives></ref><ref id="cit2"><label>2</label><citation-alternatives><mixed-citation xml:lang="ru">G. Tomar, A. Barwari. Fundamental of electronic devices and circuits. Springer, 2019.</mixed-citation><mixed-citation xml:lang="en">G. Tomar, A. Barwari. Fundamental of electronic devices and circuits. Springer, 2019.</mixed-citation></citation-alternatives></ref><ref id="cit3"><label>3</label><citation-alternatives><mixed-citation xml:lang="ru">International Technology Roadmap for Semiconductors (ITRS) Interconnect, 2020 Edition. [Online] Available: https://irds.ieee.org/editions/2020 (accessed on 25 September 2023).</mixed-citation><mixed-citation xml:lang="en">International Technology Roadmap for Semiconductors (ITRS) Interconnect, 2020 Edition. [Online] Available: https://irds.ieee.org/editions/2020 (accessed on 25 September 2023).</mixed-citation></citation-alternatives></ref><ref id="cit4"><label>4</label><citation-alternatives><mixed-citation xml:lang="ru">J.H. Davies. The physics of low dimensional semiconductors. New York: Plenum, 1998.</mixed-citation><mixed-citation xml:lang="en">J.H. Davies. The physics of low dimensional semiconductors. New York: Plenum, 1998.</mixed-citation></citation-alternatives></ref><ref id="cit5"><label>5</label><citation-alternatives><mixed-citation xml:lang="ru">D. Li, Y. Wu, P. Kim, L. Shi, P. Yang, A. Majumdar. Thermal conductivity of individual silicon nanowires // “Appl. Phys. Lett.”, (2003), V. 83, No.14, 2934-2936.</mixed-citation><mixed-citation xml:lang="en">D. Li, Y. Wu, P. Kim, L. Shi, P. Yang, A. Majumdar. Thermal conductivity of individual silicon nanowires // “Appl. Phys. Lett.”, (2003), V. 83, No.14, 2934-2936.</mixed-citation></citation-alternatives></ref><ref id="cit6"><label>6</label><citation-alternatives><mixed-citation xml:lang="ru">X. Yang, A.C To, R. Tian. Anomalous heat conduction behavior in thin finite-size silicon Nanowires // “Nanotechnology”, (2010), V. 21, No. 15, 155704.</mixed-citation><mixed-citation xml:lang="en">X. Yang, A.C To, R. Tian. Anomalous heat conduction behavior in thin finite-size silicon Nanowires // “Nanotechnology”, (2010), V. 21, No. 15, 155704.</mixed-citation></citation-alternatives></ref><ref id="cit7"><label>7</label><citation-alternatives><mixed-citation xml:lang="ru">P.K. Schelling, SR. Phillpot, P. Keblinski. Comparison of atomic-level simulation methods for computing thermal conductivity // “Phys. Rev. B”, (2002), V. 65, No. 14, 144306.</mixed-citation><mixed-citation xml:lang="en">P.K. Schelling, SR. Phillpot, P. Keblinski. Comparison of atomic-level simulation methods for computing thermal conductivity // “Phys. Rev. B”, (2002), V. 65, No. 14, 144306.</mixed-citation></citation-alternatives></ref><ref id="cit8"><label>8</label><citation-alternatives><mixed-citation xml:lang="ru">P. Martin, Z. Aksamija, E. Pop, U. Ravaioli. Impact of phonon-surface roughness scattering on thermal conductivity of thin Si nanowires // “Phys. Rev. Lett.”, (2009), V. 102, No.12, 125503.</mixed-citation><mixed-citation xml:lang="en">P. Martin, Z. Aksamija, E. Pop, U. Ravaioli. Impact of phonon-surface roughness scattering on thermal conductivity of thin Si nanowires // “Phys. Rev. Lett.”, (2009), V. 102, No.12, 125503.</mixed-citation></citation-alternatives></ref><ref id="cit9"><label>9</label><citation-alternatives><mixed-citation xml:lang="ru">L. Liu, X. Chen. Effect of surface roughness on thermal conductivity of silicon nanowires // “J. Appl. Phys.”, (2010), V. 107, No. 3, 033501.</mixed-citation><mixed-citation xml:lang="en">L. Liu, X. Chen. Effect of surface roughness on thermal conductivity of silicon nanowires // “J. Appl. Phys.”, (2010), V. 107, No. 3, 033501.</mixed-citation></citation-alternatives></ref><ref id="cit10"><label>10</label><citation-alternatives><mixed-citation xml:lang="ru">A. Vassighi, M. Sachdev. Thermal and power management of integral circuits. New York, NY, USA: Springer-Verlag, 2006.</mixed-citation><mixed-citation xml:lang="en">A. Vassighi, M. Sachdev. Thermal and power management of integral circuits. New York, NY, USA: Springer-Verlag, 2006.</mixed-citation></citation-alternatives></ref><ref id="cit11"><label>11</label><citation-alternatives><mixed-citation xml:lang="ru">D. Wolpert, P. Ampadu. Managing temperature effects in nanoscale adaptive system. New York: Springer-Verlag, 2012.</mixed-citation><mixed-citation xml:lang="en">D. Wolpert, P. Ampadu. Managing temperature effects in nanoscale adaptive system. New York: Springer-Verlag, 2012.</mixed-citation></citation-alternatives></ref><ref id="cit12"><label>12</label><citation-alternatives><mixed-citation xml:lang="ru">A.I. Boukai, Y. Bunimovich, J. Tahir-Kheli, J.-K. Yu, W.A. Goddard III, J.R. Heath. Silicon nanowires as efficient thermoelectric materials // “Nature”, (2008), V. 451, 168-171.</mixed-citation><mixed-citation xml:lang="en">A.I. Boukai, Y. Bunimovich, J. Tahir-Kheli, J.-K. Yu, W.A. Goddard III, J.R. Heath. Silicon nanowires as efficient thermoelectric materials // “Nature”, (2008), V. 451, 168-171.</mixed-citation></citation-alternatives></ref><ref id="cit13"><label>13</label><citation-alternatives><mixed-citation xml:lang="ru">A.I. Hochbaum, R. Chen, R.D. Delgado, W. Liang, E.C. Garnett, M. Najarian, A. Majumdar, P. Yang. Enhanced thermoelectric performance of rough silicon nanowires // “Nature”, (2008), V. 451, 163-167.</mixed-citation><mixed-citation xml:lang="en">A.I. Hochbaum, R. Chen, R.D. Delgado, W. Liang, E.C. Garnett, M. Najarian, A. Majumdar, P. Yang. Enhanced thermoelectric performance of rough silicon nanowires // “Nature”, (2008), V. 451, 163-167.</mixed-citation></citation-alternatives></ref><ref id="cit14"><label>14</label><citation-alternatives><mixed-citation xml:lang="ru">R. Wang, J. Zhuge, R. Huang, T. Yu, J. Zou, D.-W. Kim, D. Park, Y. Wang. Investigation on variability in metal-gate Si nanowire MOSFETs: Analysis of variation sources and experimental characterization // “IEEE Trans. Electron Devices”, (2011), V. 58, No. 8, 2317-2325.</mixed-citation><mixed-citation xml:lang="en">R. Wang, J. Zhuge, R. Huang, T. Yu, J. Zou, D.-W. Kim, D. Park, Y. Wang. Investigation on variability in metal-gate Si nanowire MOSFETs: Analysis of variation sources and experimental characterization // “IEEE Trans. Electron Devices”, (2011), V. 58, No. 8, 2317-2325.</mixed-citation></citation-alternatives></ref><ref id="cit15"><label>15</label><citation-alternatives><mixed-citation xml:lang="ru">Z. Aksamija, U. Ravaioli. Energy Conservation in Collisional Broadening, Simulation of Semiconductor Processes Devices. Vienna: Springer, 2007.</mixed-citation><mixed-citation xml:lang="en">Z. Aksamija, U. Ravaioli. Energy Conservation in Collisional Broadening, Simulation of Semiconductor Processes Devices. Vienna: Springer, 2007.</mixed-citation></citation-alternatives></ref><ref id="cit16"><label>16</label><citation-alternatives><mixed-citation xml:lang="ru">Thermal Nanosystems and Nanomaterials. Topics in Applied Physics. Editor by S. Volz. Berlin: Springer, 2010.</mixed-citation><mixed-citation xml:lang="en">Thermal Nanosystems and Nanomaterials. Topics in Applied Physics. Editor by S. Volz. Berlin: Springer, 2010.</mixed-citation></citation-alternatives></ref><ref id="cit17"><label>17</label><citation-alternatives><mixed-citation xml:lang="ru">J. Ziman. Electrons and phonons: the theory of transport phenomena in solids. Clarendon, 1960.</mixed-citation><mixed-citation xml:lang="en">J. Ziman. Electrons and phonons: the theory of transport phenomena in solids. Clarendon, 1960.</mixed-citation></citation-alternatives></ref><ref id="cit18"><label>18</label><citation-alternatives><mixed-citation xml:lang="ru">C. Kittel. Introduction to Solid State Physics. New York: Wiley, 2005.</mixed-citation><mixed-citation xml:lang="en">C. Kittel. Introduction to Solid State Physics. New York: Wiley, 2005.</mixed-citation></citation-alternatives></ref><ref id="cit19"><label>19</label><citation-alternatives><mixed-citation xml:lang="ru">F.X. Alvarez, D. Jou, A. Sellitto A. Phonon boundary effects and thermal conductivity of rough concentric nanowires // “J. Heat Transf. T. ASME”, (2011), V. 133, 022402.</mixed-citation><mixed-citation xml:lang="en">F.X. Alvarez, D. Jou, A. Sellitto A. Phonon boundary effects and thermal conductivity of rough concentric nanowires // “J. Heat Transf. T. ASME”, (2011), V. 133, 022402.</mixed-citation></citation-alternatives></ref><ref id="cit20"><label>20</label><citation-alternatives><mixed-citation xml:lang="ru">N. Mingo. Calculation of Si nanowire thermal conductivity using complete phonon dispersion relations // “Phys. Rev. B”, (2003), V. 68, 113308.</mixed-citation><mixed-citation xml:lang="en">N. Mingo. Calculation of Si nanowire thermal conductivity using complete phonon dispersion relations // “Phys. Rev. B”, (2003), V. 68, 113308.</mixed-citation></citation-alternatives></ref><ref id="cit21"><label>21</label><citation-alternatives><mixed-citation xml:lang="ru">E. Pop, R. Dutton, K. E. Goodson. Analytic band Monte Carlo Model for electron transport in Si including acoustic and optical phonon dispersion // ”Journal of Applied Physics”, (2004), V. 96, No. 9, 4998-5005.</mixed-citation><mixed-citation xml:lang="en">E. Pop, R. Dutton, K. E. Goodson. Analytic band Monte Carlo Model for electron transport in Si including acoustic and optical phonon dispersion // ”Journal of Applied Physics”, (2004), V. 96, No. 9, 4998-5005.</mixed-citation></citation-alternatives></ref><ref id="cit22"><label>22</label><citation-alternatives><mixed-citation xml:lang="ru">M. Asheghi, Y.K. Leung, S.S. Wong, K.E. Goodson. Phonon-boundary scattering in thin silicon layers // “Appl. Phys. Lett.”, (1997), V. 71, 1798–1800.</mixed-citation><mixed-citation xml:lang="en">M. Asheghi, Y.K. Leung, S.S. Wong, K.E. Goodson. Phonon-boundary scattering in thin silicon layers // “Appl. Phys. Lett.”, (1997), V. 71, 1798–1800.</mixed-citation></citation-alternatives></ref><ref id="cit23"><label>23</label><citation-alternatives><mixed-citation xml:lang="ru">Z. Aksamija, U. Ravaioli. Joule heating and phonon transport in nanoscale silicon MOSFETs // ”IEEE International Conference on Electro/Information Technology”, (2007), V. 1, 70-72.</mixed-citation><mixed-citation xml:lang="en">Z. Aksamija, U. Ravaioli. Joule heating and phonon transport in nanoscale silicon MOSFETs // ”IEEE International Conference on Electro/Information Technology”, (2007), V. 1, 70-72.</mixed-citation></citation-alternatives></ref></ref-list><fn-group><fn fn-type="conflict"><p>The authors declare that there are no conflicts of interest present.</p></fn></fn-group></back></article>
