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Vol 12, No 4 (2022)
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MATHEMATICAL MODELING AND SOFTWARE OF TECHNOLOGICAL PROCESSES

5-13 22
Abstract

The article discusses various ways of developing models of technical complexes and analyzes the advantages and disadvantages of the applied modeling methods. On the basis of the study, the authors propose an approach to creating a modeling tool environment that allows design HIL-simulation stands for a wide range of technological processes in various application areas, operating in real time. The tools used in modeling include software and hardware.

14-24 12
Abstract

The microcontroller KOMDIV-MKE of domestic design is part of the interface modules of the IM-AZS family. The modules are designed for use as technological process and equipment controllers of a gas filling station. A proprietary control program has been ported to the modules. The program operation principle is described. A list of its improvements during porting is given.

25-37 15
Abstract

The article contains an overview of some existing modeling solutions in some industries. Definitions of digital twins are given. Descriptions of programs implementing the functionality of digital twins, including open source solutions, are given. Some mathematical solutions are described.

PROGRAMMING ISSUES

38-42 17
Abstract

The GDB interactive debugger is the main debugging tool for programs developed on the Linux platform. While providing ample opportunities for debugging, GDB, however, is not able to meet all the needs of, for example, multiprocessor systems developers. One of the solutions is the GDB/MI text interface discussed in this article, with which third-party developers can extend the functionality of the debugger.

43-49 24
Abstract

Developers using the freely distributed GCC compiler often face the problem of correctly building the compiler and the necessary binary utilities from source texts, as well as their configuration to the desired target architecture. The article provides a general sequence of actions for building of a cross-compiler and binary utilities for the MIPS architecture, suitable for different versions of the compiler. Examples of problems that may arise in this case and ways to solve them are given.

50-55 17
Abstract

Modern operating systems use abstraction layers to describe data input/output interfaces. Operating systems based on these principles conform to the POSIX standard, which describes syntax and semantics of system calls. However, use of standards alone does not guarantee the consistency of used software components and correctness of designed algorithms. This article describes several logical errors which are typical for complex systems, different parts of which were developed independently of each other. An analysis of the described errors allows us to state that definition of the detailed models for software components and their subsequent formal verification and application for code testing can significantly improve robustness of the created operating systems and applications.

DESIGN AND MODELING OF VLSI

56-60 15
Abstract

This paper presents an approach to assessing the sufficiency of the measures used to mitigation faults in digital blocks of system-on-chip (SoC) during the shifting to technology with smaller technology node and the feasibility of this shifting, provided that the previous level of fault tolerance is maintained. The approach is based on the fault injection technique and is demonstrated by the example of shifting an external static memory controller from 250 nm to 65 nm technology.

61-67 16
Abstract

The article discusses the method of machine learning on graphs, presents the architecture of modern graph neural networks, as well as their application for solving digital VLSI design problems, especially in placing standard cells at the layout design stage. The solution of this problem using machine learning methods is an urgent problem, since the standard placement algorithms used in modern CAD systems face difficulties when working with digital circuits, the number of logic elements in which reaches 106 and more. This leads to a long operating time and non-optimality of the results obtained in terms of the occupied area and power consumption of the designed VLSI.

68-72 19
Abstract

In the development of high-performance microprocessors, low abstraction level modeling creates a large load on computing machines and takes a lot of time. A simulation method that allows to reduce load on computers and simulation time using a part of the simulated microprocessor in the form of a higher-level abstraction is considered in this article.

73-80 17
Abstract

In this work, we solve the inverse problem of computational photolithography. The mask topology was calculated using deep neural networks. The study was aimed at comparing the effectiveness of the neural network architectures U-Net, Erf-Net and Deep Lab v3, as well as the built-in Calibre Workbench algorithms in solving the problem of inverse photolithography. Training of artificial neural networks was performed on a specially generated and labeled data set. Random shapes were generated using the Calibre Workbench CAD mask for the 90nm transistor gate mask. The comparison was made in terms of accuracy and speed. Edge placement error (EPE) and intersection over union (IOU) were used as metrics in the work. The use of neural networks made it possible to speed up the calculation of the mask by 100 times while maintaining an accuracy of 92% on the IOU metric.

MODELING OF PHYSICAL PROCESSES IN MICRO- AND NANO- ELECTRONICS

81-85 14
Abstract

The behavior of anomalous thermal conductivity of silicon cylindrical elliptical nanostructures with elliptical cross-section in stationary states is discussed. Numerical simulation has shown that the abnormal thermal conductivity is related to the shape of the cross-section. The smaller the ratio of the large semi-axis of the ellipse to the smaller one, the higher the thermal conductivity of elliptical nanostructures. And that with an increase in temperature, the contribution to abnormal thermal conductivity due to a decrease in the Knudsen number prevails over the contribution due to a decrease in volumetric thermal conductivity. Therefore, with an increase in temperature, the thermal conductivity of cylindrical nanostructures with an elliptical cross-section increases by 28% in the range from 200 to 400 K. The obtained results demonstrate the anomalous nature of the thermal conductivity of thin silicon cylindrical nanostructures with an elliptical cross-section, which distinguishes them from the classical ideas about the thermal conductivity of solids.



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ISSN 2225-7349 (Print)
ISSN 3033-6422 (Online)