For citations:
Podkovyrov A.A., Andreev A.V. Features of the Development of an Organic Package for Multi-Chip Modules Based on Chiplets. SRISA Proceedings. 2024;14(4):54-61. (In Russ.)
Podkovyrov A.A., Andreev A.V. Features of the Development of an Organic Package for Multi-Chip Modules Based on Chiplets. SRISA Proceedings. 2024;14(4):54-61. (In Russ.)